- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/24 - Contacts for co-operating by abutting resiliently mounted
Patent holdings for IPC class H01R 13/24
Total number of patents in this class: 2860
10-year publication summary
200
|
202
|
260
|
325
|
338
|
312
|
282
|
228
|
193
|
68
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1034 |
89 |
Lotes Co., Ltd. | 346 |
84 |
Sumitomo Wiring Systems, Ltd. | 9367 |
71 |
Japan Aviation Electronics Industry, Limited | 1585 |
69 |
Samsung Electronics Co., Ltd. | 131630 |
65 |
Molex, LLC | 1792 |
55 |
Omron Corporation | 6968 |
50 |
TE Connectivity Solutions GmbH | 2580 |
49 |
Sumitomo Electric Industries, Ltd. | 14131 |
48 |
AutoNetworks Technologies, Ltd. | 5809 |
48 |
Apple Inc. | 50209 |
45 |
Rosenberger Hochfrequenztechnik GmbH & Co. KG | 677 |
43 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
37 |
Yazaki Corporation | 6282 |
35 |
Intel Corporation | 45621 |
31 |
Tyco Electronics (shanghai) Co. Ltd. | 759 |
29 |
NHK Spring Co., Ltd. | 1657 |
27 |
Yokowo Co., Ltd. | 464 |
26 |
Canon Inc. | 36841 |
25 |
Enplas Corporation | 900 |
25 |
Other owners | 1909 |